Heatsink of an image capture device

ABSTRACT

An image capture device includes a heatsink having a cutout within the heatsink. The image capture device also includes a housing, a mounting structure located on an external side of the housing, and an integrated sensor and lens assembly (ISLA) extending through the cutout in the heatsink and connecting to the mounting structure. The ISLA is free of contact with the heatsink. The heatsink can include mounting flanges to support components including printed circuit boards and battery cages.

TECHNICAL FIELD

This disclosure relates to a heatsink in an image capture device andspecifically a heatsink for an image capture device.

BACKGROUND

Photography during physical activity has been improved by use ofsimple-to-operate, lightweight, compact cameras or imaging devices.Advancements in technology have allowed for more functionality to beadded to the cameras. Faster components have been added to the cameras,allowing for clearer images to be taken by the cameras. Additionally,the cameras have been sealed so that the cameras may be splashed,submerged, or otherwise inundated with water. These improvements havecaused an increase in thermal loads within the camera.

SUMMARY

Disclosed herein are implementations of a heatsink for an image capturedevice.

The present teachings provide: an image capture device. The imagecapture device has a heatsink with a cutout. The image capture devicehas a housing with a mounting structure located on an external side ofthe housing; and an integrated sensor and lens assembly (ISLA) extendingthrough the cutout in the heatsink and connecting to the mountingstructure. The ISLA extends through the cutout and is free of contactwith the heatsink.

The present teachings provide: an image capture device. The imagecapture device has a heatsink with a mounting flange and a battery cage.The mounting flange includes a finger mounting flange in communicationwith the battery cage so that the battery cage is supported within theimage capture device.

The present teachings provide: an image capture device. The imagecapture device has a housing and a heatsink located partially orcompletely within the housing. The heatsink has a planar surface andmounting flanges extending from the planar surface. A printed circuitboard (PCB) is connected to the mounting flanges, and an antenna isconnected to the PCB. The mounting flanges maintain a space between thehousing and the antenna.

Additional teachings are described in further detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure is best understood from the following detaileddescription when read in conjunction with the accompanying drawings. Itis emphasized that, according to common practice, the various featuresof the drawings are not to-scale. On the contrary, the dimensions of thevarious features are arbitrarily expanded or reduced for clarity.

FIGS. 1A-B are isometric views of an example of an image capture device.

FIGS. 2A-B are isometric views of another example of an image capturedevice.

FIG. 3 is a block diagram of electronic components of an image capturedevice.

FIG. 4A is a front perspective view of a heatsink, an ISLA, and amounting structure of an image capture device.

FIG. 4B is a partial exploded view of the image capture device of FIG.1A.

FIG. 4C is a rear view of the ISLA connected to the mounting structureand extending through the heatsink of FIGS. 4A-4B.

FIG. 4D is a side view of the mounting structure, the housing, theheatsink, and the ISLA of FIGS. 4A-4C.

FIG. 5 is a rear perspective view of a battery cage connected to aheatsink.

FIG. 6A is a rear perspective view of the heatsink of FIGS. 4A-4D.

FIG. 6B is a front view of the heatsink of FIG. 6A.

FIG. 6C is a rear view of the heatsink of FIGS. 6A-6B.

FIG. 7A is a partial top perspective view of an example of a globalpositioning system (GPS) printed circuit board and the heatsink of FIGS.4A-4D.

FIG. 7B is a partial cross-sectional view of an image capture deviceshowing the GPS printed circuit board of FIG. 7A extending below thehousing.

DETAILED DESCRIPTION

As more components and processing power are added to image capturedevices, more heat is added to image capture devices. Improved thermalmanagement in an image capture device becomes important to provide forextended use of the image capture device. Management of heat with andalong a heatsink may allow for extended use of the image capture devicebefore the heat retained within the image capture device impactsoperation or before components become potentially damaged. The heatsinkmay have a hole that an (ISLA) extends through, where the ISLA is freeof contact with the heatsink. The heatsink may support a battery and/ora battery cage, may support a sensor, circuit board, or other componentin a GPS, or may include a combination of the described components. Thepresent disclosure relates to heatsinks in image capture devices such asheatsinks that are free of communication with an ISLA, create a spacebetween a housing and components of a GPS, support a battery cage, orinclude a combination of these components.

FIGS. 1A-B are isometric views of an example of an image capture device100. The image capture device 100 may include a body 102, a lens 104structured on a front surface of the body 102, various indicators on thefront surface of the body 102 (such as light-emitting diodes (LEDs),displays, and the like), various input mechanisms (such as buttons,switches, and/or touch-screens), and electronics (such as imagingelectronics, power electronics, etc.) internal to the body 102 forcapturing images via the lens 104 and/or performing other functions. Thelens 104 is configured to receive light incident upon the lens 104 andto direct received light onto an image sensor internal to the body 102.The image capture device 100 may be configured to capture images andvideo and to store captured images and video for subsequent display orplayback.

The image capture device 100 may include an LED or another form ofindicator 106 to indicate a status of the image capture device 100 and aliquid-crystal display (LCD) or other form of a display 108 to showstatus information such as battery life, camera mode, elapsed time, andthe like. The image capture device 100 may also include a mode button110 and a shutter button 112 that are configured to allow a user of theimage capture device 100 to interact with the image capture device 100.For example, the mode button 110 and the shutter button 112 may be usedto turn the image capture device 100 on and off, scroll through modesand settings, and select modes and change settings. The image capturedevice 100 may include additional buttons or interfaces (not shown) tosupport and/or control additional functionality.

The image capture device 100 may include a door 114 coupled to the body102, for example, using a hinge mechanism 116. The door 114 may besecured to the body 102 using a latch mechanism 118 that releasablyengages the body 102 at a position generally opposite the hingemechanism 116. The door 114 may also include a seal 120 and a batteryinterface 122. When the door 114 is an open position, access is providedto an input-output (I/O) interface 124 for connecting to orcommunicating with external devices as described below and to a batteryreceptacle 126 for placement and replacement of a battery (not shown).The battery receptacle 126 includes operative connections (not shown)for power transfer between the battery and the image capture device 100.When the door 114 is in a closed position, the seal 120 engages a flange(not shown) or other interface to provide an environmental seal, and thebattery interface 122 engages the battery to secure the battery in thebattery receptacle 126. The door 114 can also have a removed position(not shown) where the entire door 114 is separated from the imagecapture device 100, that is, where both the hinge mechanism 116 and thelatch mechanism 118 are decoupled from the body 102 to allow the door114 to be removed from the image capture device 100.

The image capture device 100 may include a microphone 128 on a frontsurface and another microphone 130 on a side surface. The image capturedevice 100 may include other microphones on other surfaces (not shown).The microphones 128, 130 may be configured to receive and record audiosignals in conjunction with recording video or separate from recordingof video. The image capture device 100 may include a speaker 132 on abottom surface of the image capture device 100. The image capture device100 may include other speakers on other surfaces (not shown). Thespeaker 132 may be configured to play back recorded audio or emit soundsassociated with notifications.

A front surface of the image capture device 100 may include a drainagechannel 134. A bottom surface of the image capture device 100 mayinclude an interconnect mechanism 136 for connecting the image capturedevice 100 to a handle grip or other securing device. In the exampleshown in FIG. 1B, the interconnect mechanism 136 includes foldingprotrusions configured to move between a nested or collapsed position asshown and an extended or open position (not shown) that facilitatescoupling of the protrusions to mating protrusions of other devices suchas handle grips, mounts, clips, or like devices.

The image capture device 100 may include an interactive display 138 thatallows for interaction with the image capture device 100 whilesimultaneously displaying information on a surface of the image capturedevice 100.

The image capture device 100 of FIGS. 1A-B includes an exterior thatencompasses and protects internal electronics. In the present example,the exterior includes six surfaces (i.e. a front face, a left face, aright face, a back face, a top face, and a bottom face) that form arectangular cuboid. Furthermore, both the front and rear surfaces of theimage capture device 100 are rectangular. In other embodiments, theexterior may have a different shape. The image capture device 100 may bemade of a rigid material such as plastic, aluminum, steel, orfiberglass. The image capture device 100 may include features other thanthose described here. For example, the image capture device 100 mayinclude additional buttons or different interface features, such asinterchangeable lenses, cold shoes, and hot shoes that can addfunctional features to the image capture device 100.

The image capture device 100 may include various types of image sensors,such as charge-coupled device (CCD) sensors, active pixel sensors (APS),complementary metal-oxide-semiconductor (CMOS) sensors, N-typemetal-oxide-semiconductor (NMOS) sensors, and/or any other image sensoror combination of image sensors.

Although not illustrated, in various embodiments, the image capturedevice 100 may include other additional electrical components (e.g., animage processor, camera system-on-chip (SoC), etc.), which may beincluded on one or more circuit boards within the body 102 of the imagecapture device 100.

The image capture device 100 may interface with or communicate with anexternal device, such as an external user interface device (not shown),via a wired or wireless computing communication link (e.g., the I/Ointerface 124). Any number of computing communication links may be used.The computing communication link may be a direct computing communicationlink or an indirect computing communication link, such as a linkincluding another device or a network, such as the internet, may beused.

In some implementations, the computing communication link may be a Wi-Filink, an infrared link, a Bluetooth (BT) link, a cellular link, a ZigBeelink, a near field communications (NFC) link, such as an ISO/IEC 20643protocol link, an Advanced Network Technology interoperability (ANT+)link, and/or any other wireless communications link or combination oflinks.

In some implementations, the computing communication link may be an HDMIlink, a USB link, a digital video interface link, a display portinterface link, such as a Video Electronics Standards Association (VESA)digital display interface link, an Ethernet link, a Thunderbolt link,and/or other wired computing communication link.

The image capture device 100 may transmit images, such as panoramicimages, or portions thereof, to the external user interface device viathe computing communication link, and the external user interface devicemay store, process, display, or a combination thereof the panoramicimages.

The external user interface device may be a computing device, such as asmartphone, a tablet computer, a phablet, a smart watch, a portablecomputer, personal computing device, and/or another device orcombination of devices configured to receive user input, communicateinformation with the image capture device 100 via the computingcommunication link, or receive user input and communicate informationwith the image capture device 100 via the computing communication link.

The external user interface device may display, or otherwise present,content, such as images or video, acquired by the image capture device100. For example, a display of the external user interface device may bea viewport into the three-dimensional space represented by the panoramicimages or video captured or created by the image capture device 100.

The external user interface device may communicate information, such asmetadata, to the image capture device 100. For example, the externaluser interface device may send orientation information of the externaluser interface device with respect to a defined coordinate system to theimage capture device 100, such that the image capture device 100 maydetermine an orientation of the external user interface device relativeto the image capture device 100.

Based on the determined orientation, the image capture device 100 mayidentify a portion of the panoramic images or video captured by theimage capture device 100 for the image capture device 100 to send to theexternal user interface device for presentation as the viewport. In someimplementations, based on the determined orientation, the image capturedevice 100 may determine the location of the external user interfacedevice and/or the dimensions for viewing of a portion of the panoramicimages or video.

The external user interface device may implement or execute one or moreapplications to manage or control the image capture device 100. Forexample, the external user interface device may include an applicationfor controlling camera configuration, video acquisition, video display,or any other configurable or controllable aspect of the image capturedevice 100.

The user interface device, such as via an application, may generate andshare, such as via a cloud-based or social media service, one or moreimages, or short video clips, such as in response to user input. In someimplementations, the external user interface device, such as via anapplication, may remotely control the image capture device 100 such asin response to user input.

The external user interface device, such as via an application, maydisplay unprocessed or minimally processed images or video captured bythe image capture device 100 contemporaneously with capturing the imagesor video by the image capture device 100, such as for shot framing orlive preview, and which may be performed in response to user input. Insome implementations, the external user interface device, such as via anapplication, may mark one or more key moments contemporaneously withcapturing the images or video by the image capture device 100, such aswith a tag or highlight in response to a user input or user gesture.

The external user interface device, such as via an application, maydisplay or otherwise present marks or tags associated with images orvideo, such as in response to user input. For example, marks may bepresented in a camera roll application for location review and/orplayback of video highlights.

The external user interface device, such as via an application, maywirelessly control camera software, hardware, or both. For example, theexternal user interface device may include a web-based graphicalinterface accessible by a user for selecting a live or previouslyrecorded video stream from the image capture device 100 for display onthe external user interface device.

The external user interface device may receive information indicating auser setting, such as an image resolution setting (e.g., 3840 pixels by2160 pixels), a frame rate setting (e.g., 60 frames per second (fps)), alocation setting, and/or a context setting, which may indicate anactivity, such as mountain biking, in response to user input, and maycommunicate the settings, or related information, to the image capturedevice 100.

FIGS. 2A-B illustrate another example of an image capture device 200.The image capture device 200 includes a body 202 and two camera lenses204 and 206 disposed on opposing surfaces of the body 202, for example,in a back-to-back configuration, Janus configuration, or offset Janusconfiguration. The body 202 of the image capture device 200 may be madeof a rigid material such as plastic, aluminum, steel, or fiberglass.

The image capture device 200 includes various indicators on the front ofthe surface of the body 202 (such as LEDs, displays, and the like),various input mechanisms (such as buttons, switches, and touch-screenmechanisms), and electronics (e.g., imaging electronics, powerelectronics, etc.) internal to the body 202 that are configured tosupport image capture via the two camera lenses 204 and 206 and/orperform other imaging functions.

The image capture device 200 includes various indicators, for example,LEDs 208, 210 to indicate a status of the image capture device 100. Theimage capture device 200 may include a mode button 212 and a shutterbutton 214 configured to allow a user of the image capture device 200 tointeract with the image capture device 200, to turn the image capturedevice 200 on, and to otherwise configure the operating mode of theimage capture device 200. It should be appreciated, however, that, inalternate embodiments, the image capture device 200 may includeadditional buttons or inputs to support and/or control additionalfunctionality.

The image capture device 200 may include an interconnect mechanism 216for connecting the image capture device 200 to a handle grip or othersecuring device. In the example shown in FIGS. 2A and 2B, theinterconnect mechanism 216 includes folding protrusions configured tomove between a nested or collapsed position (not shown) and an extendedor open position as shown that facilitates coupling of the protrusionsto mating protrusions of other devices such as handle grips, mounts,clips, or like devices.

The image capture device 200 may include audio components 218, 220, 222such as microphones configured to receive and record audio signals(e.g., voice or other audio commands) in conjunction with recordingvideo. The audio component 218, 220, 222 can also be configured to playback audio signals or provide notifications or alerts, for example,using speakers. Placement of the audio components 218, 220, 222 may beon one or more of several surfaces of the image capture device 200. Inthe example of FIGS. 2A and 2B, the image capture device 200 includesthree audio components 218, 220, 222, with the audio component 218 on afront surface, the audio component 220 on a side surface, and the audiocomponent 222 on a back surface of the image capture device 200. Othernumbers and configurations for the audio components are also possible.

The image capture device 200 may include an interactive display 224 thatallows for interaction with the image capture device 200 whilesimultaneously displaying information on a surface of the image capturedevice 200. The interactive display 224 may include an I/O interface,receive touch inputs, display image information during video capture,and/or provide status information to a user. The status informationprovided by the interactive display 224 may include battery power level,memory card capacity, time elapsed for a recorded video, etc.

The image capture device 200 may include a release mechanism 225 thatreceives a user input to in order to change a position of a door (notshown) of the image capture device 200. The release mechanism 225 may beused to open the door (not shown) in order to access a battery, abattery receptacle, an I/O interface, a memory card interface, etc. (notshown) that are similar to components described in respect to the imagecapture device 100 of FIGS. 1A and 1B.

In some embodiments, the image capture device 200 described hereinincludes features other than those described. For example, instead ofthe I/O interface and the interactive display 224, the image capturedevice 200 may include additional interfaces or different interfacefeatures. For example, the image capture device 200 may includeadditional buttons or different interface features, such asinterchangeable lenses, cold shoes, and hot shoes that can addfunctional features to the image capture device 200.

FIG. 3 is a block diagram of electronic components in an image capturedevice 300. The image capture device 300 may be a single-lens imagecapture device, a multi-lens image capture device, or variationsthereof, including an image capture device with multiple capabilitiessuch as use of interchangeable ISLA. The description of the imagecapture device 300 is also applicable to the image capture devices 100,200 of FIGS. 1A-B and 2A-B.

The image capture device 300 includes a body 302 which includeselectronic components such as capture components 310, a processingapparatus 320, data interface components 330, movement sensors 340,power components 350, and/or user interface components 360.

The capture components 310 include one or more image sensors 312 forcapturing images and one or more microphones 314 for capturing audio.

The image sensor(s) 312 is configured to detect light of a certainspectrum (e.g., the visible spectrum or the infrared spectrum) andconvey information constituting an image as electrical signals (e.g.,analog or digital signals). The image sensor(s) 312 detects lightincident through a lens coupled or connected to the body 302. The imagesensor(s) 312 may be any suitable type of image sensor, such as acharge-coupled device (CCD) sensor, active pixel sensor (APS),complementary metal-oxide-semiconductor (CMOS) sensor, N-typemetal-oxide-semiconductor (NMOS) sensor, and/or any other image sensoror combination of image sensors. Image signals from the image sensor(s)312 may be passed to other electronic components of the image capturedevice 300 via a bus 380, such as to the processing apparatus 320. Insome implementations, the image sensor(s) 312 includes adigital-to-analog converter. A multi-lens variation of the image capturedevice 300 can include multiple image sensors 312.

The microphone(s) 314 is configured to detect sound, which may berecorded in conjunction with capturing images to form a video. Themicrophone(s) 314 may also detect sound in order to receive audiblecommands to control the image capture device 300.

The processing apparatus 320 may be configured to perform image signalprocessing (e.g., filtering, tone mapping, stitching, and/or encoding)to generate output images based on image data from the image sensor(s)312. The processing apparatus 320 may include one or more processorshaving single or multiple processing cores. In some implementations, theprocessing apparatus 320 may include an application specific integratedcircuit (ASIC). For example, the processing apparatus 320 may include acustom image signal processor. The processing apparatus 320 may exchangedata (e.g., image data) with other components of the image capturedevice 300, such as the image sensor(s) 312, via the bus 380.

The processing apparatus 320 may include memory, such as a random-accessmemory (RAM) device, flash memory, or another suitable type of storagedevice, such as a non-transitory computer-readable memory. The memory ofthe processing apparatus 320 may include executable instructions anddata that can be accessed by one or more processors of the processingapparatus 320. For example, the processing apparatus 320 may include oneor more dynamic random-access memory (DRAM) modules, such as double datarate synchronous dynamic random-access memory (DDR SDRAM). In someimplementations, the processing apparatus 320 may include a digitalsignal processor (DSP). More than one processing apparatus may also bepresent or associated with the image capture device 300.

The data interface components 330 enable communication between the imagecapture device 300 and other electronic devices, such as a remotecontrol, a smartphone, a tablet computer, a laptop computer, a desktopcomputer, or a storage device. For example, the data interfacecomponents 330 may be used to receive commands to operate the imagecapture device 300, transfer image data to other electronic devices,and/or transfer other signals or information to and from the imagecapture device 300. The data interface components 330 may be configuredfor wired and/or wireless communication. For example, the data interfacecomponents 330 may include an I/O interface 332 that provides wiredcommunication for the image capture device, which may be a USB interface(e.g., USB type-C), a high-definition multimedia interface (HDMI), or aFireWire interface. The data interface components 330 may include awireless data interface 334 that provides wireless communication for theimage capture device 300, such as a Bluetooth interface, a ZigBeeinterface, and/or a Wi-Fi interface. The data interface components 330may include a storage interface 336, such as a memory card slotconfigured to receive and operatively couple to a storage device (e.g.,a memory card) for data transfer with the image capture device 300(e.g., for storing captured images and/or recorded audio and video).

The movement sensors 340 may detect the position and movement of theimage capture device 300. The movement sensors 340 may include aposition sensor 342, an accelerometer 344, or a gyroscope 346. Theposition sensor 342, such as a GPS sensor, is used to determine aposition of the image capture device 300. The accelerometer 344, such asa three-axis accelerometer, measures linear motion (e.g., linearacceleration) of the image capture device 300. The gyroscope 346, suchas a three-axis gyroscope, measures rotational motion (e.g., rate ofrotation) of the image capture device 300. Other types of movementsensors 340 may also be present or associated with the image capturedevice 300.

The power components 350 may receive, store, and/or provide power foroperating the image capture device 300. The power components 350 mayinclude a battery interface 352 and a battery 354. The battery interface352 operatively couples to the battery 354, for example, with conductivecontacts to transfer power from the battery 354 to the other electroniccomponents of the image capture device 300. The power components 350 mayalso include the I/O interface 332, as indicated in dotted line, and thepower components 350 may receive power from an external source, such asa wall plug or external battery, for operating the image capture device300 and/or charging the battery 354 of the image capture device 300.

The user interface components 360 may allow the user to interact withthe image capture device 300, for example, providing outputs to the userand receiving inputs from the user. The user interface components 360may include visual output components 362 to visually communicateinformation and/or present captured images to the user. The visualoutput components 362 may include one or more lights 364 and/or moredisplays 366. The display(s) 366 may be configured as a touch screenthat receives inputs from the user. The user interface components 360may also include one or more speakers 368. The speaker(s) 368 canfunction as an audio output component that audibly communicatesinformation and/or presents recorded audio to the user. The userinterface components 360 may also include one or more physical inputinterfaces 370 that are physically manipulated by the user to provideinput to the image capture device 300. The physical input interfaces 370may, for example, be configured as buttons, toggles, or switches. Theuser interface components 360 may also be considered to include themicrophone(s) 314, as indicated in dotted line, and the microphone(s)314 may function to receive audio inputs from the user, such as voicecommands.

FIGS. 4A-D are views of internal components of an image capture devicesuch as the image capture devices 100, 200 of FIGS. 1A-2B. The viewsdepict the heatsink 400 having mounting flanges 402, component recesses404A and 404B, and a cutout 412.

FIG. 4A is a front perspective view of a heatsink 400 having componentrecesses 404A, B. As shown, a first component recess 404A is an LCDrecess 406 that may receive an LCD screen (not shown) and a secondcomponent recess 404B is a microphone membrane recess 408 that mayreceive a microphone, a microphone membrane, or both (not shown). Abayonet 426 extends on an outer side of the heatsink 400 and housing(not shown) so that additional lenses or lens covers (not shown) may beconnected to the image capture device proximate to or covering an ISLA430. A bayonet 426 as discussed herein is an example of one type orstyle of mounting structure that may be used to connect the ISLA 430, acover lens (not shown), or both. Other types of mounting structures,such as mounting structures having threads, detents, slots, or otherconnection features are also possible. The bayonet 426 is connected to ahousing by fasteners 440 extending from a forward side of the bayonet426 towards a rear side of the bayonet 426. The ISLA 430 extends throughthe heatsink 400 and into the bayonet 426 so that a forward end 450 ofthe ISLA 430 is connected and stabilized by fasteners 446 (FIG. 4B)extending from the rear side of the bayonet 426 towards the forward sideof the bayonet 426. The forward end 450 of the ISLA 430 is connected tothe bayonet 426, which acts as a stabilization point for the ISLA 430and combats movement of the optical axis.

The bayonet 426 is located external to the housing (not shown) and theheatsink 400 so that the ISLA 430 is connected in a forward region ofthe image capture device to stabilize the ISLA 430. The bayonet 426 mayfunction to support the forward end 450 of the ISLA 430. A forward endof the ISLA 430 may extend beyond the bayonet 426. A forwardmost end ofthe ISLA 430 may be flush with a forward surface of the bayonet 426. Aforwardmost end of the ISLA 430 may be counter sunk into the bayonet426. The ISLA 430 may be free of direct contact with the housing (notshown), the heatsink 400, or both. The forward end 450 of the ISLA 430may be supported only by the bayonet 426. The forward end 450, a rearend (not shown), or both ends of the ISLA 430 may be connected to thebayonet 426, the housing, the heatsink 400, or a combination thereof.

FIG. 4B is a partial exploded view of an image capture device. Theexploded view shows the heatsink 400 of FIG. 4A separated from thebayonet 426, the ISLA 430, and a housing 436. The ISLA 430 extendsthrough the cutout 412 so that the ISLA 430 can directly connect to thebayonet 426 via the fasteners 446. The heatsink 400 and the housing 436are connected via a combination of fasteners 442 (FIG. 4C) and heatstakes (not shown) so that the image capture device has supportedinternal components. The bayonet 426 is connected to an opposing surfaceof the housing 436 as the heatsink 400 by fasteners 444 so that all ofthe components are grounded to the housing 436 directly or indirectly.For example, the bayonet 426 and heatsink 400 may be grounded through aconductive gasket formed, for example, of silicone. In another example,the bayonet 426 may be directly connected to both the heatsink 400 andthe housing 436. The bayonet 426 may only be connected to the housing436. The bayonet 426 may be located on an external surface of thehousing 436. The bayonet 426 and the heatsink 400 may be spaced apart bythe housing 436 so that the bayonet is located further forward withinthe image capture device than the heatsink 400. In FIG. 4B, the housing436 extends around the bayonet 426 such that a portion of the bayonet426 is still exposed to receive different lenses, filters, or lenscovers (not shown). For example, the housing 436 may cover the fasteners444 and leave connection features 428 exposed.

FIG. 4C illustrates a rear view depicting the heatsink 400 of FIGS.4A-4B. The bayonet 426 is located on a forward side of the heatsink 400so that the ISLA 430 extends from a rear side of the heatsink 400through the cutout 412 and into contact with the bayonet 426. Theheatsink 400 is connected to and supported by a housing (not shown) byfasteners 442 and heat stakes (not shown). The ISLA 430 includesmounting arms 432 that receive fasteners 446 to connect the ISLA to thebayonet 426. The cutout 412 may be shaped to mirror the shape of theISLA 430, the mounting arms 432, or both. The cutout 412 and the ISLA430 may be complementary in shape. The fasteners 446 extend throughmounting arms 432 of the ISLA 430 into the bayonet 426; however, asillustrated, one of the fasteners 446 has been removed from a boss 433in one of the mounting arms 432 to illustrate a passage 438 through themounting arm 432 into the bayonet 426. As shown, the mounting arms 432may be coplanar with the cutout 412. The mounting arms 432 may eachinclude a boss 433. The bosses 433 may receive the fasteners 446. Thebosses 433 may be circular, oval, U-shaped, or C shaped. The mountingarms 432 may function to hold a front of the ISLA 430 relative to thebayonet 426.

FIG. 4D is a partial cross-sectional view illustrating the relationshipof the heatsink 400, the bayonet 426, and the housing 436 of an imagecapture device when connected together via the fasteners 442, 444, 446.The heatsink 400 and the housing 436 are connected via fasteners 442(FIG. 4C). The bayonet 426 is connected to the housing 436 by fasteners444 extending from an external location with respect to the imagecapture device to an internal location. The bayonet 426 functions tosupport a forward end 450 of the ISLA 430 so that the ISLA 430 is freeof movement relative to the housing 436, the heatsink 400, or both. Thebayonet 426 is located proximate to a forward end 450 of the ISLA 430(e.g., within a range between 1 mm and 7 mm or a range between 3 mm and5 mm).

As shown in FIG. 4D, the bayonet 426 may function to align the ISLA 430relative to the housing 436, the heatsink 400, or both so that images orvideos may be captured by a user without the ISLA 430 moving relative tothe housing 436. The bayonet 426 may be partially or fully locatedoutside of the housing 436. The mounting arms 432 (FIG. 4C), the ISLA430, or both may be free of contact with the housing 436. The fasteners442, 444, 446 may extend from an internal location (e.g., a rear side ofthe heatsink 400, the housing 436, the bayonet 426, or a combinationthereof) toward an external location of the image capture device. TheISLA 430 includes the forward end 450 that extends through the heatsink400, the housing 436, and the bayonet 426, and is connected to thebayonet via the fasteners 446. A rear end 452 of the ISLA 430 extendsinto an internal location of the image capture device, for example,below a GPS assembly 454. The GPS assembly 454 is connected to one ofthe mounting flanges 402 of the heatsink 400 as shown.

FIG. 5 is a rear perspective view of a connection between a battery cage502 and a heatsink 504. The heatsink 504 includes mounting flanges 506,508 and a finger mounting flange 510 extending outward from the heatsink504. The finger mounting flange 510 receives fasteners 512 that connecta housing (not shown) to the finger mounting flange 510. The fingermounting flange 510 functions to connect the heatsink 504 to a housing(not shown), connect the heatsink 504 to the battery cage 502, or both.The finger mounting flange 510 functions to assist in forming awatertight connection between the housing (FIG. 4B) and the heatsink504. The finger mounting flange 510 includes seal recesses 514, sealmembers 516, and a space 518 that is located between the seal recesses514. The finger mounting flange 510 may include the seal recesses 514.

In another example, the seal recesses 514 and the seal members 516 maybe located in or on the housing. The seal recesses 514 function topartially or fully counter sink the seal members 516. Each seal recess514 may receive one of the seal members 516. The finger mounting flange510 may include a same number of seal members 516 and seal recesses 514.The seal members 516 and the seal recesses 514 may be located on abottom surface of the finger mounting flange 510, between the fingermounting flange 510 and the housing (not shown), or both. For example,the finger mounting flange 510 may include two seal recesses 514 and thehousing may include two seal recesses 514. The seal recesses 514, sealmembers 516, or both may be circular, square, rectangular, triangular,geometric, symmetrical, non-symmetrical, or a combination thereof. Theseal recesses 514 may be ring recesses. The seal members 516 may belocated between the housing and the finger mounting flange 510. Thefinger mounting flange 510 may have an area that receives one or more,two or more, three or more, or even four or more seal members 516. Thespace 518 may be a reduction in material from the heatsink 504 whereheat is not introduced into the heatsink 504. The seal recesses 514 andseal members 516 may be located on an opposite side of the fingermounting flange 510 as the battery cage 502.

The finger mounting flange 510 is connected to the battery cage 502 by abattery connector 522. The battery cage 502 is also connected to aplanar surface 524 of the heatsink 504 via a fastener 526 that extendthrough a cage connector 542. The battery cage 502 functions to transmitheat between a battery (not shown) and the heatsink 504, retain abattery within the image capture device, or both. The battery cage 502may be in direct or indirect contact with the finger mounting flanges510, the planar surface 524, or both. The battery cage 502 may be madeof or include metal, plastic, a polymer, rubber, an elastomer, or acombination thereof. The battery cage 502 may be made of a metalcomprising aluminum, titanium, steel, iron, or a combination thereof.The battery cage 502 may be solid or may include through holes 534. Thethrough holes 534 may be round, square, rectangular, symmetrical,asymmetrical geometric, non-geometric, or a combination thereof. Thethrough holes 534 may be located within a forward side, a rearward side,or both sides of the battery cage 502. A forward side of the batterycage 502 may be directly connected to a rear side of the heatsink 504.The battery cage 502 and the heatsink 504 may be connected via thefasteners 512. The battery cage 502 may have a planar surface (notshown), the heatsink 504 may have the planar surface 524, and the twoplanar surfaces may be in contact with each other. The battery cage 502may be directly or indirectly connected to the finger mounting flange510. The battery cage 502 may be connected to both the planar surface524 and the finger mounting flange 510 of the heatsink 504. A batteryconnector 522 may connect the battery cage 502 to the finger mountingflange 510.

The battery connector 522 extends between the finger mounting flange 510and the battery cage 502. The battery connector 522 functions torestrict movement of the battery cage 502 relative to the heatsink 504,to maintain contact between the battery cage 502 and the heatsink 504,or both. For example, the battery connector 522 may retain the batterycage 502 against the planar surface 524 of the heatsink 504. The batteryconnector 522 may be generally “L” shaped, “C” shaped, straight, curved,or a combination thereof. The battery connector 522 may be a monolithicpart of or a discrete part from the battery cage 502, the fingermounting flange 510, or both. The battery connector 522 may extenddownward from the battery cage 502 over a battery boss 536 in the fingermounting flange 510 so that a fastener 526 may extend through andconnect the battery cage 502 to the finger mounting flange 510. Thebattery connector 522 may be flat, smooth, ribbed 540, include raisedsurfaces, or a combination thereof. The battery connector 522 may belocated opposite a GPS assembly 528.

The mounting flange 508 of the heatsink 504 is connected to and supportsthe GPS assembly 528 so that the GPS assembly 528 is fixedly connectedwithin the image capture device. The GPS assembly 528 includes a printedcircuit board (PCB) 530 and an antenna 532. The antenna 532 is fixednear an outside of the image capture device by the mounting flange 508of the heatsink 504 so that the antenna 532 can accurately send andreceive information.

FIGS. 6A-C are various views of a heatsink 600. The heatsink 600 can beused with an image capture device such as the image capture devices 100,200 of FIGS. 1A-2B so that thermal energy within the image capturedevice is distributed and moved away from components that have thermalenergy. The heatsink 600 includes mounting flanges 602A, 602B, and 602Cthat extend outward from a body portion of the heatsink 600 to supportcomponents. The heatsink 600 includes component recesses 604 includingan LCD recess 606, a microphone membrane recess 608, and a microphonerecess 610 so that components located within the recesses 604, 606, 608,610 are at least partially housed within the heatsink 600.

FIG. 6A is a rear perspective view of the heatsink 600, which functionsto remove heat from components, distribute heat, redistribute heat,prevent components from becoming overheated, or to perform a combinationthereof. In one example, the heatsink 600 may have a portion that islocated external to a housing (not shown) of the image capture device.In another example, the heatsink 600 may have a portion that is locatedinternal to a housing (not shown) of the image capture device. Theheatsink 600 may be located entirely internal to a housing, for example,if used with the image capture devices 100, 200 of FIGS. 1A-2B. Theheatsink 600 may be located entirely external to a housing (not shown).The heatsink 600 may include a body portion. The body portion of theheatsink 600 may include a planar surface that extends parallel to aforward surface, a rearward surface, or both, of the image capturedevice and mirrors a shape of a forward portion or a rearward portion ofthe image capture device. The planar surface of the heatsink 600 isconnected to mounting flanges including a first mounting flange 602A, asecond mounting flange 602B, and a finger mounting flange 602C thatextend away from the planar surface to support other components.

The mounting flanges 602A, 602B, 602C function to support components,printed circuit boards, electrical elements, batteries, battery cages,or a combination thereof. The mounting flanges 602A, 602B, 602C functionto provide a heat transfer surface, ground electrical elements (e.g., abattery or a printed circuit board), protect internal components, or acombination thereof. The mounting flanges 602A, 602B, 602C may create apartial cage around internal components of the image capture device suchas a battery, a battery cage, an ISLA, or a combination thereof. Themounting flanges 602A, 602B, 602C may extend normal to a planar surfaceof the heatsink 600. The mounting flanges 602A, 602B, 602C may belocated in an end corner region of the heatsink 600. For example, themounting flanges 602A, 602B, 602C may be located in a top right corner,a top left corner, a bottom left corner, a bottom right corner, or acombination thereof. The mounting flanges 602A, 602B, 602C may belocated in a central region of the heatsink 600. The mounting flanges602A, 602B may be located in an upper region of the heatsink 600 and themounting flange 602C may be located in a lower region of the heatsink600 opposite the upper region. The mounting flanges 602A, 602B, 602C mayextend from a location proximate to one or more of the componentrecesses 604, 606, 608, 610.

The component recesses 604, 606, 608, 610 function to receivecomponents, partially recess a component, or both. The front side of theheatsink 600 includes the (LCD recess 606 and the microphone membranerecess 608 shown in FIG. 6B that function to remove thermal mass fromthe LCD (not shown) and other components in contact with the front sideof the heatsink 600. The rear side of the heatsink 600 includes themicrophone recess 610 shown in FIG. 6A that functions to remove thermalmass from the microphone (not shown) and other components in contactwith the rear side of the heatsink 600.

FIG. 6A illustrates a shield feature 614 that extends between a firstregion of the heatsink 600 comprising the microphone recess 610 and thecutout 612 and a second region of the heatsink 600. As shown, the secondregion is located on an opposite side of the heatsink 600 as the LCDrecess 606 that houses an LCD (not shown). The shield feature 614 mayreceive a seal or gasket (not shown) that acts as a conductive shield.The shield feature 614 may function to support a seal or gasket thatprevents or limits electrical radiation from extending from a firstcomponent to a second component or a first region to a second regionwithin the image capture device. For example, the shield feature 614 mayretain a seal or gasket that prevents electrical radiation fromextending from the LCD to the microphone, the ISLA, or both. The shieldfeature 614 may prevent some electrical radiation from extending from aregion proximate to the shield feature 614. The shield feature 614 mayreceive or be a connection location for a gasket or some other memberthat prevents or limits conduction of electrical radiation. The shieldfeature 614 may be a raised portion of the heatsink 600, may create arecess within the heatsink 600 by creating an elevated portion of theheatsink 600, may be raised so that the seal or gasket is compressedwhen the image capture device is closed, or a combination thereof.

In another example, the heatsink 600 comprises locator pins 618 thatextend away from the heatsink 600 and assist in locating the heatsink600 within manufacturing equipment, installation equipment, relative toother components of the image capture device, or a combination thereof.The locator pins 618 may function to ensure proper alignment ofcomponents relative to each other so that heat is evenly distributedalong the heatsink 600. For example, the locator pins 618 align a mainprinted circuit board (not shown) with the heatsink 600.

As illustrated, the heatsink 600 includes battery bosses 620 andconnection bosses 622 that connect the heatsink 600 to other componentswithin the image capture device. The battery bosses 620 connect theheatsink 600 to a battery cage (not shown), a battery connector (e.g.,the battery connector 522 of FIG. 5), or both, and the connection bosses622 receive fasteners to connect the heatsink 600 to a housing (notshown), a planar surface of the battery cage (not shown), a bayonet (notshown), or a combination thereof.

FIG. 6B is a front view of the heatsink 600 showing several componentrecesses 604. The component recesses 604 may be an absence of materialor a reduction in material. For example, the heatsink 600 may be thinnerat a location of the component recesses 604, create a pocket thatreceives a component of the image capture system, or both. The componentrecesses 604 may connect to a component and the component may be flushor sub-flush with a plane of the heatsink 600. The component recesses604 may reduce an amount that a component (e.g., a microphone, an LCD,or a gasket) extends above a plane of the heatsink 600.

As shown in FIG. 6B, the heatsink 600 includes a space 616. The space616 is located between the LCD recess 606 and the microphone membranerecess 608 so that mass of the heatsink 600 is reduced where nocomponents are present. In the example of FIG. 6B, the space 616 is anabsence of material. In other examples, the space 616 may reduce mass ofthe heatsink 600 or be located in a region with low thermal application.For example, the space 616 may be located in a region where heat is notintroduced into the heatsink 600. The space 616 may be in a locationwhere an opposing component (not shown) extends toward the heatsink sothat the space 616 prevents contact between the opposing component andthe heatsink 600. The space 616 may be free of receiving any components.The space 616 may be located on an opposite side or a same side as themounting flange 602C (shown in FIG. 6A). The space 616 may besymmetrical; asymmetrical; square; round; oval; geometric;non-geometric; shaped to fit between recesses, cutouts, or components ofthe image device; or a combination thereof. The space 616 may be locatedon a front side, a rear side, or both sides of the heatsink 600. Morethan one space 616 may be located on the heatsink 600. For example, afront and a back of the heatsink 600 may each include the space 616, orthe front or the back may include two or more spaces 616. The space 616may balance mass in the heatsink 600, thermal performance of theheatsink 600, or both. The space 616 may remove mass from a locationwhere there is less of a thermal load so that more mass may be locatedat an area with a greater thermal load so that a temperature of theheatsink 600 may be substantially equal from side to side or edge toedge (e.g., a left region v. a right region or a top region v. a bottomregion).

FIG. 6B illustrates the battery bosses 620 as positioned to allowconnection of a battery cage (not shown) to a planar surface of theheatsink 600. The battery bosses 620 are located adjacent to the cutout612 so that the battery cage when installed does not interfere with theISLA (not shown). The heatsink 600 includes mounting holes 624 locatedthroughout the heatsink 600 that may be used to connect the heatsink 600to other components of the image capture device. The mounting holes 624may connect the heatsink 600 to a front housing, a battery cage, amicrophone, a printed circuit board, an LCD, a bayonet, an ISLA, or acombination thereof.

FIG. 6C is a rear view of the heatsink 600 showing the first mountingflange 602A and the second mounting flange 602B that are positioned tosupport a GPS assembly (not shown). The heatsink 600 includes the fingermounting flange 602C that connects to and supports a battery cage (notshown) via a battery boss 620.

FIG. 7A is a top perspective view of a heatsink 700 and a GPS assembly702 for use with an image capture device such as the image capturedevices 100, 200 of FIGS. 1A-2B. The GPS assembly 702 may function tocorrelate positioning data with an image or video at a time the image orvideo is taken by monitoring a position of the image capture device. Theheatsink 700 includes mounting flanges 704 including flange bosses 706that receive fasteners 708 to locate the GPS assembly 702 within animage capture device. The fasteners 708 connect a PCB 710 of the GPSassembly 702 to the flange bosses 706 located in a first mounting flange712 and a second mounting flange 714, respectively. The PCB 710 includesan antenna 716 that is located between the first mounting flange 712 andthe second mounting flange 714. The GPS assembly 702 may include theantenna 716, the PCB 710, the heatsink 700, a switch 720, a shield (notshown), or a combination thereof. The GPS assembly 702 may be located inan upper portion of the image capture device. The GPS assembly 702 maybe located proximate to a housing 718 (FIG. 7B) and the heatsink 700 mayorient the GPS assembly 702 relative to the housing 718. The GPSassembly 702 and the antenna 716 may be located close to the housing 718without being in contact with the housing 718. The antenna 716 islocated between the PCB 710 and the housing 718.

FIG. 7B is a cross-sectional view depicting the relationship between theheatsink 700, the GPS assembly 702, and the housing 718. The GPSassembly 702 is connected to the heatsink 700 at the first mountingflange 712 and the second mounting flange 714 by fasteners 708 so thatthe GPS assembly 702 is fixedly located within an image capture device.The antenna 716 is spaced apart from the housing 718 by a distance thatrepresents a gap G. The gap G between the antenna 716 and the housing718 may be sized to keep the antenna 716 and the housing 718 fromcontacting each other. The gap G may be sufficiently small in size suchthat signals to and from the antenna 716 may enter and exit the housing718 unimpeded by the housing 718 and other componentry in the imagecapture device.

For example, the gap G between the housing 718 and the antenna 716 maymeasure about 0.01 mm or more, 0.05 mm or more, 0.1 mm or more, 0.2 mmor more, or 0.5 mm or more. The gap G between the housing 718 and theantenna 716 may be about 4 mm or less, 2 mm or less, or 1 mm or less. Athickness of the mounting flanges 712, 714 may affect a size of the gapG. The thickness of the mounting flanges 712, 714 and the antenna 716may be substantially the same, the antenna 716 may have a thicknessgreater than one or both of the mounting flanges 712, 714, the antenna716 may have a thickness less than one or both of the mounting flanges712, 714, or a combination thereof. The antenna 716 may be located onthe PCB 710 between the mounting flanges 712, 714 (e.g., the firstmounting flange 712 and the second mounting flange 714). The PCB 710 ofthe GPS assembly 702 may be grounded by the mounting flanges 712, 714,grounded by the fasteners 708 that connect the GPS assembly 702 to themounting flanges 712, 714, or both. The fasteners 708 may have exposedconductive material (e.g., silver or copper) that may assist ingrounding the GPS assembly 702 relative to the mounting flanges 712,714.

While the disclosure has been described in connection with certainembodiments, it is to be understood that the disclosure is not to belimited to the disclosed embodiments but, on the contrary, is intendedto cover various modifications and equivalent arrangements includedwithin the scope of the appended claims, which scope is to be accordedthe broadest interpretation so as to encompass all such modificationsand equivalent structures as is permitted under the law.

1. An image capture device comprising: a heatsink comprising a cutoutwithin the heatsink; a housing; a mounting structure located on anexternal side of the housing; and an integrated sensor and lens assembly(ISLA) extending through the cutout in the heatsink and connecting tothe mounting structure, wherein the ISLA is free of contact with theheatsink.
 2. The image capture device of claim 1, wherein the ISLA isconnected to the mounting structure via mounting arms of the ISLA andthe ISLA is free of contact with the housing.
 3. The image capturedevice of claim 1, wherein the mounting structure is free of contactwith the heatsink, and wherein the mounting structure includes abayonet.
 4. The image capture device of claim 2, wherein the cutoutwithin the heatsink is complementary in shape to the mounting arms ofthe ISLA.
 5. The image capture device of claim 1, wherein the heatsinkincludes a space adjacent to the cutout so that a mass of the heatsink,thermal performance of the heatsink, or both, are balanced along theheatsink.
 6. The image capture device of claim 5, wherein the space isan absence of material within the heatsink, is a through hole within theheatsink, or both.
 7. The image capture device of claim 1, wherein theheatsink includes two or more mounting flanges that extend away from aplanar surface of the heatsink.
 8. The image capture device of claim 7,wherein a space of the heatsink is located on an opposite side of theplanar surface as the two or more mounting flanges.
 9. An image capturedevice, comprising: a heatsink comprising a cutout within the heatsinkand a mounting flange; a housing; a mounting structure located on anexternal side of the housing; an integrated sensor and lens assembly(ISLA) extending through the cutout in the heatsink and connecting tothe mounting structure, wherein the ISLA is free of contact with theheatsink; and a battery cage, wherein the mounting flange includes afinger mounting flange in communication with the battery cage to supportthe battery cage within the image capture device.
 10. The image capturedevice of claim 9, wherein the battery cage is directly connected to thefinger mounting flange.
 11. The image capture device of claim 9, whereinthe image capture device includes a housing and the heatsink is entirelylocated within the housing.
 12. The image capture device of claim 9,wherein the heatsink includes a planar surface and the battery cage isconnected to both the planar surface and the finger mounting flange. 13.The image capture device of claim 9, wherein the finger mounting flangeincludes seal recesses.
 14. The image capture device of claim 9, whereinthe finger mounting flange includes a space configured to balance a massof the heatsink, balance thermal performance of the heatsink, or bothalong the heatsink.
 15. An image capture device comprising: a housing; aheatsink located partially or completely within the housing, wherein theheatsink comprises a planar surface defining a cutout within theheatsink and mounting flanges extending from the planar surface; amounting structure located on an external side of the housing; anintegrated sensor and lens assembly (ISLA) extending through the cutoutin the heatsink and connecting to the mounting structure, wherein theISLA is free of contact with the heatsink; a printed circuit boardconnected to the mounting flanges; and an antenna connected to theprinted circuit board, wherein the mounting flanges maintain a spacebetween the housing and the antenna.
 16. The image capture device ofclaim 15, wherein a thickness of the antenna is equal to or greater thana thickness of mounting flanges.
 17. The image capture device of claim15, wherein the mounting flanges are a first mounting flange and asecond mounting flange, and wherein the antenna is located between thefirst mounting flange and the second mounting flange.
 18. The imagecapture device of claim 17, wherein the antenna is located between theprinted circuit board and the housing.
 19. The image capture device ofclaim 15, wherein the printed circuit board is connected to and groundedto the mounting flanges via fasteners.
 20. The image capture device ofclaim 15, wherein the printed circuit board and the housing are locatedon opposite sides of the mounting flanges.